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SKU:33233278
Feature:1. POWERFUL AND HIGH EFFICIENCY: Made of copper material and special chemical material to ensure high efficiency, strong force, saving time and materials2. OXIDATION AND CORROSION RESISTANCE: Used to remove and absorb excess solder with strong resistance to oxidation and corrosion, which has good thermal conductivity and soldering performance, realize absorption3. AVOID SHORT CIRCUIT: The tin suction wire should be used when the components are soldered and the pins are connected to tin, the welding on the pins can be sucked away to guarantee that there is no short circuit between the pins4. FOR BGA PROCESS: Soldering wire can be used to the pads of BGA components, using a soldering wire to the pads when reballing for BGA components can greatly increase the success rate5. 5PCS IN TOTAL: The package contain a total of 5pcs solder wicks, enough for you to replace and use, very convenientHow to Use:Step 1: For the solder that you want to remove, place an appropriate length of tin suction wire on the ed reflow point, and then use an electric soldering tip to heat the solder and melt , and then will be sucked by the tin suction wire.Step 2: Once the solder has been picked up, remove both the soldering iron and the pick up wire.Step 3: Please cut off the used desoldering wire with scissors.Specification:Item Type: Solder WickMaterial: CopperWidth: Approx. 2mm / 0.08inLength: Approx. 1.5meter / 4.9ftOperating Tempe
POWERFUL AND HIGH EFFICIENCY: Made of copper material and special chemical material to ensure high efficiency, strong force, saving time and materials
OXIDATION AND CORROSION RESISTANCE: Used to remove and absorb excess solder with strong resistance to oxidation and corrosion, which has good thermal conductivity and soldering performance, realize absorption
AVOID SHORT CIRCUIT: The tin suction wire should be used when the components are soldered and the pins are connected to tin, the welding on the pins can be sucked away to guarantee that there is no short circuit between the pins
FOR BGA PROCESS: Soldering wire can be used to the pads of BGA components, using a soldering wire to the pads when reballing for BGA components can greatly increase the success rate
5PCS IN TOTAL: The package contain a total of 5pcs solder wicks, enough for you to replace and use, very convenient